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It is an insulating and heat-dissipating product processed into the form of a pad, having a clay-like texture.
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A product that has reduced the low molecular weight siloxane that may cause contact damage to a certain level.
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It is a grease with a characteristic thermal conductivity and specialized for TIM use. It cannot be reused and is effective air gaps in the form of a gel.
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Be directly attaching to a heat source that does not require insulation properties, the temperature can be lowered to reduce the thermal load of electronic devices.
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It is an insulating and heat dissipating product processed into the form of a pad, made of ceramic or silicon material having a clay-like texture
Test method | TYSS-TL-15 | TYSS-TM-30 | TYSS-TH-50 | TYSS-TH-70 | TYSS-TH-90 | |
---|---|---|---|---|---|---|
Appearance / Color | - | Green | Pink | Gray | Gray | Gray |
Thickness [㎜] | ASTM D374 | 0.5 ~ 10 | 0.5 ~ 10 | 0.5 ~ 10 | 0.5 ~ 10 | 0.5 ~ 10 |
Density [g/㎤] | ASTM D792 | 2.4 | 3.1 | 3.3 | 3.5 | 3.6 |
Thermal conductivity [W/m.K] | ASTM D5470 | 1.5 | 3 | 5 | 7 | 9 |
Hardness [Shore 00] | ASTM D2240 | 55 | 55 | 55 | 50 | 55 |
Breakdown strength [KV/㎜] | ASTM D149 | > 8.0 | ≥ 8.0 | 5 | 5 | 5 |
Flammability | UL94 | V-0 | V-0 | V-0 | V-0 | V-0 |
Contact
It is a material of which phase changes at a specific temperature; it has the property of transiting from solid to gel
Test method | TYSG-TM-30 | |
---|---|---|
Color | - | Gray |
Phase Change Temp. [℃] | - | 50 |
Thermal conductivity [W/m.K] | ASTM D5470 | 3.5 |
Thickness [㎜] | - | 0.25 |
Contact
It is a grease with a characteristic thermal conductivity and specialized for TIM use. It cannot be reused and is effective air gaps in the form of a gel.
Test method | TYSG-TM-30 | |
---|---|---|
Appearance / Color | - | Gray |
Density [g/㎤] | ASTM D792 | 3.0 ~3.1 |
Thermal conductivity [W/m.K] | ASTM D5470 | 3.0 |
Volatilization rate [%] | Fed.Std.791 | < 1.0 |
Cone penetration (0.1 ㎜) | GB/T269 | 260 ± 20 |
Flammability | UL94 | V-0 |
Contact
By directly attaching to a heat source that does not require insulation properties, the temperature can be lowered to reduce the thermal load of electronic devices.
Test method | TYCS-20T-AP | |
---|---|---|
Thickness [㎜] | - | ~ 0.2 |
Thermal conductivity [W/m.K] | ASTM E1461 (Z-axis) | 5 |
Density [g/㎤] | TY Method | 1.03 |
Heat Resistance [℃] | TY Method | 100 |
EMI Shielding Effectiveness [dB] 30 MHz ~ 1.5 GHz |
TY Method | 50 |
Contact
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E-mail : info@3c-America.com
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