Thermal solution

The Product Line-up

Read More +

It is an insulating and heat-dissipating product processed into the form of a pad, having a clay-like texture.

THERMAL PAD

Read More +

A product that has reduced the low molecular weight siloxane that may cause contact damage to a certain level.

TYVS
(Low Volatile Silicone pad)

Read More +

It is a grease with a characteristic thermal conductivity and specialized for TIM use. It cannot be reused and is effective air gaps in the form of a gel.

THERMAL GREASE

Read More +

Be directly attaching to a heat source that does not require insulation properties, the temperature can be lowered to reduce the thermal load of electronic devices.

CARBON/METAL
COMPOSITE SHEET

Product Catalog

If you want more

View More +

THERMAL PAD

It is an insulating and heat dissipating product processed into the form of a pad, made of ceramic or silicon material having a clay-like texture

Test method TYSS-TL-15 TYSS-TM-30 TYSS-TH-50 TYSS-TH-70 TYSS-TH-90
Appearance / Color - Green Pink Gray Gray Gray
Thickness [㎜] ASTM D374 0.5 ~ 10 0.5 ~ 10 0.5 ~ 10 0.5 ~ 10 0.5 ~ 10
Density [g/㎤] ASTM D792 2.4 3.1 3.3 3.5 3.6
Thermal conductivity [W/m.K] ASTM D5470 1.5 3 5 7 9
Hardness [Shore 00] ASTM D2240 55 55 55 50 55
Breakdown strength [KV/㎜] ASTM D149 > 8.0 ≥ 8.0 5 5 5
Flammability UL94 V-0 V-0 V-0 V-0 V-0

Contact

PCM

It is a material of which phase changes at a specific temperature; it has the property of transiting from solid to gel

Test method TYSG-TM-30
Color - Gray
Phase Change Temp. [℃] - 50
Thermal conductivity [W/m.K] ASTM D5470 3.5
Thickness [㎜] - 0.25

Contact

THERMAL GREASE

It is a grease with a characteristic thermal conductivity and specialized for TIM use. It cannot be reused and is effective air gaps in the form of a gel.

Test method TYSG-TM-30
Appearance / Color - Gray
Density [g/㎤] ASTM D792 3.0 ~3.1
Thermal conductivity [W/m.K] ASTM D5470 3.0
Volatilization rate [%] Fed.Std.791 < 1.0
Cone penetration (0.1 ㎜) GB/T269 260 ± 20
Flammability UL94 V-0

Contact

CARBON/METAL COMPOSITE SHEET

By directly attaching to a heat source that does not require insulation properties, the temperature can be lowered to reduce the thermal load of electronic devices.

Test method TYCS-20T-AP
Thickness [㎜] - ~ 0.2
Thermal conductivity [W/m.K] ASTM E1461 (Z-axis) 5
Density [g/㎤] TY Method 1.03
Heat Resistance [℃] TY Method 100
EMI Shielding Effectiveness [dB]
30 MHz ~ 1.5 GHz
TY Method 50

Contact

DOWNLOAD