Die structure design using TOP transfer system
Designed to accommodate 4 chase to up to 12 chase
Affordable, well-designed EMC FLOW, with the best molding quality with Bottom Transfer. The molding compound does not require preheating and has a short cycle time for easy operation.
Designed to balance EMC flow
EMC Preheat is not required
QCC(Quick Change Chase) approach
Bottom/Top Ejector pin retract way to design the best molding quality
High performance vacuum mold design
High productivity, efficiency, and cost savings over Conventional molds. Designed to save compound, it has the best molding quality with Bottom Transfer.
EMC saving design compared to conventional mold
The best quality of molding using the bottom transfer method
The best molded quality design using the bottom ejector pin retract method
High performance vacuum mold design
Tel : 469-669-0667
E-mail : info@3c-America.com
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